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Power chips are connected to external circuits through product packaging, and their performance relies on the assistance of the packaging. In high-power situations, power chips are generally packaged as power modules. Chip interconnection describes the electric connection on the upper surface area of the chip, which is normally aluminum bonding wire in conventional modules. ^ Traditional power component bundle cross-section
Today, industrial silicon carbide power modules still mainly utilize the packaging innovation of this wire-bonded typical silicon IGBT component. They encounter problems such as large high-frequency parasitic specifications, not enough heat dissipation capacity, low-temperature resistance, and inadequate insulation toughness, which restrict making use of silicon carbide semiconductors. The screen of outstanding performance. In order to solve these issues and completely make use of the significant possible benefits of silicon carbide chips, several new product packaging innovations and solutions for silicon carbide power modules have actually emerged in recent times.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have developed from gold cable bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have established from gold wires to copper wires, and the driving pressure is cost reduction; high-power devices have created from aluminum wires (strips) to Cu Clips, and the driving pressure is to improve product performance. The higher the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that utilizes a solid copper bridge soldered to solder to attach chips and pins. Compared with typical bonding product packaging methods, Cu Clip modern technology has the following advantages:
1. The link in between the chip and the pins is made from copper sheets, which, to a specific degree, replaces the typical wire bonding technique between the chip and the pins. Consequently, a special plan resistance value, higher present flow, and better thermal conductivity can be acquired.
2. The lead pin welding location does not require to be silver-plated, which can completely conserve the cost of silver plating and bad silver plating.
3. The product appearance is completely constant with normal products and is mostly utilized in web servers, portable computers, batteries/drives, graphics cards, motors, power products, and other fields.
Cu Clip has 2 bonding techniques.
All copper sheet bonding approach
Both the Gate pad and the Source pad are clip-based. This bonding technique is much more costly and intricate, yet it can attain better Rdson and better thermal effects.
( copper strip)
Copper sheet plus cord bonding technique
The resource pad utilizes a Clip approach, and the Gate makes use of a Cable technique. This bonding technique is somewhat less expensive than the all-copper bonding approach, saving wafer location (appropriate to extremely little gateway areas). The process is less complex than the all-copper bonding method and can acquire much better Rdson and far better thermal effect.
Distributor of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper price per pound, please feel free to contact us and send an inquiry.
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