Power chips are connected to outside circuits via packaging, and their performance relies on the assistance of the product packaging. In high-power situations, power chips are typically packaged as power modules. Chip interconnection refers to the electrical connection on the upper surface of the chip, which is typically light weight aluminum bonding cable in conventional modules. ^
Standard power module plan cross-section
Today, industrial silicon carbide power components still mostly make use of the product packaging modern technology of this wire-bonded traditional silicon IGBT module. They face troubles such as big high-frequency parasitical specifications, insufficient heat dissipation ability, low-temperature resistance, and not enough insulation stamina, which restrict the use of silicon carbide semiconductors. The display of outstanding performance. In order to resolve these troubles and totally manipulate the significant possible advantages of silicon carbide chips, many new packaging modern technologies and solutions for silicon carbide power components have arised in recent times.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have created from gold wire bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have developed from gold wires to copper cords, and the driving pressure is cost decrease; high-power gadgets have established from light weight aluminum cords (strips) to Cu Clips, and the driving force is to enhance product efficiency. The higher the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a strong copper bridge soldered to solder to attach chips and pins. Compared to traditional bonding product packaging methods, Cu Clip technology has the complying with advantages:
1. The connection between the chip and the pins is constructed from copper sheets, which, to a specific degree, replaces the standard cable bonding method in between the chip and the pins. Consequently, a distinct bundle resistance value, higher present circulation, and far better thermal conductivity can be acquired.
2. The lead pin welding area does not need to be silver-plated, which can fully save the price of silver plating and inadequate silver plating.
3. The product appearance is entirely regular with typical products and is mainly made use of in web servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power materials, and various other areas.
Cu Clip has two bonding approaches.
All copper sheet bonding technique
Both eviction pad and the Resource pad are clip-based. This bonding approach is much more expensive and intricate, however it can accomplish much better Rdson and much better thermal effects.
( copper strip)
Copper sheet plus wire bonding technique
The source pad utilizes a Clip approach, and eviction utilizes a Cable method. This bonding method is slightly less costly than the all-copper bonding method, conserving wafer area (suitable to very tiny entrance areas). The process is simpler than the all-copper bonding approach and can obtain better Rdson and far better thermal result.
Distributor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding dc clip for copper tape, please feel free to contact us and send an inquiry.
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